MPi Grey Owl Probe Cards
Canteliver Probe Card
MPI Cantilever Probe Card is greatly utilized on gold bump and pad wafer testing for Screen driver, logic, and memory system. MPI’s cantilever probes are the corresponding answer to the calls for of fine pitch, tiny pad dimension, superior velocity, less cleansing, multi-DUT, substantial pin count, and ultra-reduced leakage necessities. With excellent craftsmanship, ground breaking architecture and verified methodologies depending on mechanical and electrical simulation/measurement benefits, creating MPI the very best cantilever service provider around the world.
FCB Probe Card
The FCB Probe Card is easily the most mature engineering of buckling beam probe card. It truly is aimed to achieve the semiconductor ship manufacture time-to-market place (TTM) and price of check (COT) need. FCB is a established Alternative for a number of semiconductor production exams from early engineering pilot-runs to significant volume production (HVM). FCB is ready for gadget requiring large signal integrity probing (SI) and/or electrical power integrity probing (PI). Applications include cutting-edge SiPs/SoCs, WLP, graphic processors, micro processor, industrial microcontrollers, and much more. FCB guarantees the entire world’s ideal Over-all Charge-of-ownership (COO) for different DUT programs.
EVS Probe Card
The EVS Probe Card is undoubtedly an enhancement in excess of the traditional buckling beam probe card. Crucial functions are larger present carrying capacity (C.C.C.) and lessen well balanced Speak to pressure (BCF), as well as Over-all MEMS-like traits. EVS can certainly meet the necessity of advanced wafer probing. Precise alignment and great planarity Manage are definitely the important here aspects contributing to steady contact resistance. With its capacity and efficiency, EVS Probe Card is an excellent option for Highly developed probe cards.
Osprey probe card
The Osprey probe card is MPI’s Remedy to demand from customers for at any time finer pitch. It truly is designed for scaled-down Al pad, and it is perfect for small pitch software with peripheral and comprehensive array sample. With precise alignment and much better planarity Handle, Osprey can get to increased productiveness by multi-DUT style. The forming wire (FW) sort needle made with MPI’s personal micro fabrication procedure not only provides substantial-top quality functionality but in addition makes it possible for simple needle substitution and shortens preserving cycle time.
Kestrel Probe Card
The Kestrel Probe Card is equipped with MEMS wire (MW) needle that's designed for the desire of low pressure probing. Additionally, it includes a chance to satisfy large C.C.C. and high pin counts application. The MEMS approach makes certain extremely dependable needle properties, along with the Particular construction style enables precise alignment and planarity Manage.
MPI probe card division provides a wide range of solutions to the semiconductor wafer level test market. Integrated Circuit (IC) applications include Drivers, Logic, CIS, RF, Flip Chip and Cu Pillars. MPI’s comprehensive designs, robust manufacturing and state-of-the-art tooling, enables MPI to provide unsurpassed solutions globally for your challenges both today and for many generations to come.
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